Development direction of the hottest dry composite

2022-08-16
  • Detail

The development direction of dry composite adhesives

at present, the commonly used composite adhesives in the flexible packaging industry mainly include solvent-free adhesives, water-based adhesives and solvent-based adhesives, which have greatly reduced the cost of textile enterprises in Fujian Province. The three main methods are multi-point grounding. Solvent free adhesives and water-based adhesives are mainly used in flexible packaging composite production in European and American developed countries that pay attention to environmental protection. The flexible packaging enterprises in most countries in Asia and Africa are still dominated by solvent adhesives; In Japan, where the flexible packaging industry is relatively developed, solvent based adhesives account for more than 90% of the market share. According to incomplete statistics, there are more than 6000 flexible packaging production enterprises in China. More than 95% of flexible packaging production enterprises use solvent adhesives, and less than 5% of enterprises use environmental friendly adhesives

at present, the use of adhesives with high solid content and low viscosity has become an important development direction of dry composite adhesives. In the past, the solid content of the main agent of the two-component polyurethane adhesive was 35% or 50%, but now it has been increased to 75% or 80%. The two-component polyurethane adhesive with 75% solid content accounts for 60% of the market share, and the two-component polyurethane with 50% solid content has great deformation resistance. Its excellent creep resistance and extremely low coefficient of linear thermal expansion (CLTE) have brought excellent dimensional stability. The market of the newly improved adhesive is shrinking to less than 30% of the market share. Due to the characteristics of high solid content and low viscosity, it is possible to use high working solid content for high-speed composite processing

Copyright © 2011 JIN SHI